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Роджерс RO4350B + FR4 Mixed Dielectric RF PCB - и

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Роджерс RO4350B + FR4 Mixed Dielectric RF PCB

Модель: Rogres ro4350B Hybrid PCB

ДК: 3.48

Структура: 2Layers rogres ro4350B+2layers Fr4

Слой: 4Layers PCB

Готовая толщина: 1.0мм

Dielectric Thickness: 0.508мм

Material CoThickness: ½(18мкм)ЧЧ/ЧЧ

Finished Co Thickness: 1/0.5/0.5/1(ОЗ)

Обработка поверхности: Immersion Glod

Приложение: Communication PCB

  • Подробная информация о продукте

Обзор

The RO4350B + IT180 Mix Laminate High Frequency PCB is a specialized electronic component designed for high-performance applications in the communication industry. Combining the robustness of traditional FR4 materials with the advanced properties of Rogres RO4350B, this 4-layer PCB offers exceptional electrical performance and reliability.

Material Composition

The PCB is constructed using a unique blend of materials:

  • Core Material: Rogres RO4350B, a high-frequency, low-loss laminate with a dielectric constant (ДК) of 3.48. This material is known for its stability and low moisture absorption, making it ideal for high-speed digital and microwave applications.
  • Support Layers: Two layers of FR4, a standard fiberglass-reinforced epoxy laminate, provide structural support and cost-effectiveness.

Layer Configuration

The PCB features a 4-layer configuration:

  • Total Thickness: 1.0мм
  • Dielectric Thickness: 0.508mm for the RO4350B layers
  • Толщина меди: 1/0.5/0.5/1 ounce per square foot (ОЗ), ensuring optimal conductivity and current carrying capacity.

Характеристики производительности

The RO4350B + IT180 Mix Laminate High Frequency PCB offers several key performance benefits:

  • Low Loss: The RO4350B material minimizes signal loss, ensuring clear and accurate transmission over high frequencies.
  • Stable Dielectric Constant: The consistent DK of 3.48 across temperature and humidity changes maintains signal integrity.
  • High Reliability: The combination of RO4350B and FR4 provides a durable and reliable PCB suitable for demanding applications.

Производственный процесс

The production of the RO4350B + IT180 Mix Laminate High Frequency PCB involves several precision steps:

  1. Подготовка материала: RO4350B and FR4 materials are cut to size and prepared for lamination.
  2. Ламинирование: The layers are bonded together under controlled conditions to ensure uniform thickness and adhesion.
  3. Copper Cladding: Copper foil is applied to the outer layers to form the conductive circuits.
  4. Офорт: Unwanted copper is removed to create the desired circuit patterns.
  5. Покрытие: An immersion gold finish is applied to the copper surfaces for enhanced conductivity and corrosion resistance.
  6. Final Assembly: Components are mounted, and the PCB is tested to ensure it meets specifications.

Application Scenarios

The RO4350B + IT180 Mix Laminate High Frequency PCB is ideal for a range of communication applications, включая:

  • Wireless Communication Systems: Base stations, antennas, and other components requiring high-frequency signal transmission.
  • Radar Systems: High-precision radar equipment that relies on low-loss materials for accurate signal detection and processing.
  • Satellite Communications: Equipment that operates in extreme environments and requires reliable, high-speed data transmission.

Заключение

The RO4350B + IT180 Mix Laminate High Frequency PCB is a versatile and high-performance component suitable for demanding communication applications. Its combination of advanced materials and precision manufacturing ensures reliable performance and long-term durability.

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