Имя: TG180 High Density Interconnector PCBA Design

Plate: TG170 /TG180, F4BM, ФР4, FR1-4, и т. д..

Designable layers: 1-32 слои

Minimum line width and line spacing: 3мил

Minimum laser aperture: 4мил

Minimum mechanical aperture: 8мил

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm