F4BT-1/2 PTFE woven glass fabric copper clad laminates with ceramic filled

F4BT-1/2: A Micro Dispersed Ceramic PTFE Composite

Introduction to F4BT-1/2

F4BT-1/2 is a micro dispersed ceramic PTFE composite featuring woven fiberglass reinforcement. This product, developed through scientific formulation and strict technological processes, surpasses traditional PTFE copper clad laminates with its higher dielectric constant, catering to the design and manufacturing requirements of circuit miniaturization. Its enhanced performance is attributed to the incorporation of ceramic powder.

Thermal Expansion and Heat Dissipation

F4BT-1/2 boasts a low Z-axis coefficient of thermal expansion, ensuring excellent reliability for plated through-holes. Кроме того, its high thermal conductivity facilitates efficient heat dissipation in electronic devices.

Technical Specifications of F4BT-1/2

Appearance and Types

The appearance of F4BT-1/2 meets the specifications required by National and Military Standards for microwave PCB baseplates. Available types include F4BT294 and F4BT600, each designed to cater to specific application needs.

Dielectric Constant and Dimensions

• Диэлектрическая проницаемость: The material offers a dielectric constant of 2.94 for F4BT294 and 6.0 for F4BT600, suitable for various high-frequency applications.
• Dimensions: Standard dimensions are 500600 mm and 430430 мм, with custom sizes available upon request.

Thickness and Tolerance

• Thickness Options: Ranges from 0.25 mm to 4.0 мм, accommodating diverse design requirements.
• Tolerance: ±0.02 mm to ±0.07 mm depending on thickness, ensuring precision in manufacturing.

Mechanical Strength

• Warp: Maximum warp values vary with thickness, demonstrating excellent dimensional stability.
• Cutting/Punching: Ensures clean cuts without burrs, with minimum space between punching holes ranging from 0.55 mm to 1.10 мм, preventing delamination.
• Peel Strength: Maintains robust adhesion, with normal state peel strength ≥17 N/cm and post-thermal stress peel strength ≥14 N/cm.

Chemical and Electrical Properties

• Chemical Property: Suitable for chemical etching without altering dielectric properties; capable of through-hole plating with a Hot Air Level temperature limit of 263°C.
• Electrical Property: Exhibits high density, low moisture absorption, wide operating temperature range, favorable thermal conductivity, КТР, surface resistivity, volume resistivity, pin resistance, and high dielectric breakdown voltage.

This comprehensive overview highlights the superior characteristics of F4BT-1/2, making it an ideal choice for advanced electronic applications demanding high performance and reliability.