ЛОГОТИП УГКПБ
F4B-N and F4B-T Teflon Woven Glass Fabric Copper-Clad Laminates
Introduction to F4B-N and F4B-T
F4B-N and F4B-T Teflon woven glass fabric copper-clad laminates are essential materials for manufacturing Teflon woven glass fabric copper-clad laminates. The production process involves dipping treatment of the Teflon resin on alkali-free woven glass fabric, followed by drying, baking, and sintering to formulate the microwave material. These products are characterized by heat resistance, изоляция, low loss, excellent electrical performance, and non-adhesion properties. They are widely used in various industries including electronics, motors, авиация, textiles, chemicals, and food. In microwave devices, they serve as bonding films for multilayer printed circuit boards.
Types of F4B-N and F4B-T Materials
- Anti-Sticking Teflon Woven Glass Fabric: F4B-N
- Ventilated Teflon Woven Glass Fabric: F4B-T
Technical Specifications of F4B-N and F4B-T
Появление
The surface is smooth and neat with uniform glue discharge and no mechanical damage.
Размеры (мм)
- Length: A=100~200 mm
- Width: B=900~4000 mm
- Толщина:
- F4B-N: 0.08, 0.10, 0.15, 0.40 мм
- F4B-T: 0.04, 0.07 мм
- Толерантность:
- ±0.01 mm for F4B-N
- ±0.015 mm for F4B-T
- ±0.02 mm for F4B-N
- ±0.04 mm for F4B-T
- ±0.004 mm for F4B-N
- ±0.005 mm for F4B-T
Mechanical, Chemical, and Electrical Properties
| Имя | Условие испытания | Единица | Ценить |
|---|---|---|---|
| Tensile Strength | Tensile Machine | Н(±5%) | 8 |
| Рабочая температура | In Oven | градус Цельсия | 250°C long-term, 300°C discontinuous |
| Химические свойства | Dip in Acid, Alkali and Salt | All Inert | |
| Surface Resistance Coefficient | Normal Temperature | Ω | ≥10^12 |
| Volume Resistance Coefficient | Normal Temperature | Ω·cm | ≥1*10^13 |
| Breakdown Voltage | Various Thicknesses | KV | ≥0.6 to ≥1.5 |
| Диэлектрическая проницаемость | 1ГГц | εr | 2.7±0.1 |
| Коэффициент рассеяния | 1ГГц | tgδ | ≤2×10^-4 |
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