ЛОГОТИП УГКПБ
F4BMX-1/2 Teflon PCB Overview
F4BMX-1/2 is a high-performance laminate crafted by layering imported varnished glass cloth with Teflon resin and Polytrtrafluoroethylene film. This product adheres to scientific formulations and stringent technological processes, offering superior electrical performance compared to the F4B series. It features a broader range of dielectric constants, lower dielectric loss tangent, increased resistance, and more stable performance. The use of imported woven glass fabric ensures consistency in the properties of the laminate.
F4BMX-1/2 Technical Specifications
Появление
Meets the specification requirements for microwave PCB laminates according to national and military standards.
Типы
- F4BMX217
- F4BMX220
- F4BMX245
- F4BMX255
- F4BMX265
- F4BMX275
- F4BMX285
- F4BMX294
- F4BMX300
Диэлектрическая проницаемость
- F4BMX217: 2.17
- F4BMX220: 2.20
- F4BMX245: 2.45
- F4BMX255: 2.55
- F4BMX265: 2.65
- F4BMX275: 2.75
- F4BMX285: 2.85
- F4BMX294: 2.94
- F4BMX300: 3.0
Размеры (мм)
- Standard dimensions available: 300250, 380350, 440550, 500500, 460610, 600500, 840840, 8401200, 15001000, 18001000
- Customized dimensions are also available.
Толщина и толерантность (мм)
| Толщина ламината | Толерантность |
|---|---|
| 0.25 | ± 0,025 |
| 0.5 | ±0,05 |
| 0.8 | ±0,05 |
| 1.0 | ±0,05 |
| 1.5 | ± 0,075 |
| 2.0 | ± 0,09 |
| 3.0 | ±0.1 |
| 4.0 | ±0.1 |
| 5.0 | ±0.1 |
| 6.0 | ±0.12 |
| 8.0 | ±0.15 |
| 10.0 | ±0.18 |
| 12.0 | ±0.2 |
Примечание: Толщина ламината включает толщину меди. Индивидуальные ламинаты доступны для специальных размеров.
Механическая прочность
| Толщина(мм) | Максимальная деформация | Original Board | Single Side | Double Side |
|---|---|---|---|---|
| 0.25～ 0,5 | 0.030 | 0.050 | 0.025 | 0.020 |
| 0.8～ 1.0 | 0.025 | 0.030 | 0.020 | 0.020 |
| 1.5～ 2.0 | 0.020 | 0.025 | 0.015 | 0.015 |
| 3.0～ 5.0 | 0.015 | 0.020 | 0.010 | 0.010 |
Сила резания/удара:
- For thickness <1мм, no burrs after cutting; minimum space between two punching holes is 0.55mm, нет расслоения.
- For thickness >1мм, no burrs after cutting; minimum space between two punching holes is 1.10mm, нет расслоения.
Прочность на очистку (for 1oz copper):
- Нормальное состояние: ≥18N/cm; No bubble or delamination peel strength: ≥15N/cm (при постоянной влажности и температуре, and kept in molten solder at 260 degree Celsius±2 degree Celsius for 20 секунды).
Химическое свойство
The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment. Hot Air Level temperature must not exceed 253 degrees Celsius and cannot be repeated.
Электрическое свойство
| Имя | Условие испытания | Единица | Ценить |
|---|---|---|---|
| Плотность | Нормальное состояние | G/CM³ | 2.1～2.35 |
| Влажно -поглощение | Dip in distilled water at 20±2°C for 24 часы | % | ≤0.08 |
| Рабочая температура | Камера высокой температуры | градус Цельсия | -50°C～+260°C |
| Теплопроводность | W/m/k | 0.3~0.5 | |
| КТР | Typical (εr :2.1~2.3) | ppm/° C. | Х: 24(х), У: 34(y), З: 235(z) |
| КТР | Typical (εr :2.3~2.9) | ppm/° C. | Х: 16(х), У: 20(y), З: 168(z) |
| КТР | Typical (εr :2.9~3.38) | ppm/° C. | Х: 12(х), У: 15(y), З: 92(z) |
| Shrinkage Factor | 2 hours in boiling water | % | < 0.0002 |
| Поверхностное удельное сопротивление | Ток, 500В, Нормальное состояние | МОм | ≥2*10^5 |
| Under constant humidity and temperature | ≥8*10^4 | ||
| Объемный удельное сопротивление | Нормальное состояние | МОм · см | ≥8*10^6 |
| Under constant humidity and temperature | ≥2*10^5 | ||
| Surface dielectric strength | Нормальное состояние | d=1mm(Kv/mm) | ≥1.2 |
| Under constant humidity and temperature | ≥1.1 | ||
| Диэлектрическая проницаемость | 10ГГц, εr | (±2%) | See table below |
| Коэффициент рассеяния | 10GHz tgδ | See table below |
Dielectric Constant and Dissipation Factor at 10GHz
| Тип | Диэлектрическая проницаемость (εr) | Коэффициент рассеяния (tgδ) |
|---|---|---|
| F4BMX217 | 2.17 | – |
| F4BMX220 | 2.20 | – |
| F4BMX245 | 2.45 | – |
| F4BMX255 | 2.55 | – |
| F4BMX265 | 2.65 | – |
| F4BMX275 | 2.75 | – |
| F4BMX285 | 2.85 | – |
| F4BMX294 | 2.94 | – |
| F4BMX300 | 3.0 | – |
UGPCB Products and Services
UGPCB offers a variety of products including Radio/Microwave/High Frequency hybrid circuits, single layer to multilayer AnyLayerHDI, БГА, IC Heavy Copper Board, and custom solutions such as Rigid-Flex, ИЧР, Blind Buried Slotted Blind Back Drilled, and IC Carrier boards. Our services include PCB manufacturing, гальваника, and more. For any inquiries, please contact us through our website www.ugpcb.com or email us at sales@ugpcb.com.
