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Development and Characteristics of Rogers RT/Duroid 6002
The development of Rogers RT/Duroid 6002 (r=2.94) was introduced in the 1980s. The material is characterized by superior temperature stability of dielectric constant and thermal expansion coefficient of dielectric constant, which is used to improve the defects of PTFE substrate. This product is ideal for applications where the ambient temperature changes rapidly. Due to its low dielectric loss and high reliability of metallized vias, it can be used in higher frequency PCB and mixed multilayer PCB.
Rogers RT/Duroid 6002 Material: A Low Dielectric Constant Microwave Material
Rogers RT/Duroid 6002 laminates are low dielectric constant microwave materials for use in complex microwave structures. These laminates are low loss materials that provide excellent high frequency performance. With excellent mechanical and electrical properties, these materials are reliable for use in multi-layer board constructions.
Features of Rogers RT/Duroid 6002
Dielectric constant (Dk) of 2.94 +/- .04 Low thermal coefficient of Dk at 12 ppm/°C Dissipation factor of .0012 at 10GHz Low Z-axis coefficient of thermal expansion at 24 ppm/°C
Benefits of Using Rogers RT/Duroid 6002
Low loss for excellent high frequency performance Tight thickness control In-plane expansion coefficient matched to copper Low out-gassing; Ideal for space applications Excellent dimensional stability
