โลโก้ UGPCB
Structure and Composition
Base Plate and Layers
The high-frequency hybrid PCB splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from bottom to top in order. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate are also part of this structure.
High-Frequency and Auxiliary Areas
The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is fixed, while the inlay in the high-frequency area should be located at a fixed position.
Design and Features
Division of Areas
The utility model provides a high-frequency hybrid splint, which is divided into two parts: a high-frequency area and an auxiliary area. This design provides mechanical support.
High-Frequency Materials
The high-frequency area is independently arranged, and only this area is made of high-frequency materials. This minimizes the use of high-frequency board materials while satisfying high-frequency signals, thereby reducing production costs.
Product Specifications
Classification and Layers
- High Frequency Hybrid Product Classification Layers: 6 เลเยอร์
Materials and Dimensions
- Used Board: RO4350B + FR4
- ความหนา: 1.6มม
- Size: 210มม * 280มม
Surface Treatment and Applications
- Surface Treatment: Gold-plated
- Minimum Aperture: 0.25มม
- แอปพลิเคชัน: Communication
- Features: High Frequency Mixed Pressure
