โลโก้ UGPCB
Structure of the High-Frequency Hybrid Splint
Base Plate and Layers
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from bottom to top in order. The second layer of the solder resist ink layer is also present.
Substrate Composition
The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is fixed, and the inlay in the high-frequency area should be located at a fixed position.
Utility Model of the High-Frequency Hybrid Splint
Division of the Splint
The utility model provides a high-frequency hybrid splint that is divided into two parts: a high-frequency area and an auxiliary area. It provides mechanical support.
Independent Arrangement of the High-Frequency Area
The utility model discloses that the high-frequency area is independently arranged, and only the high-frequency area is made of high-frequency materials. This minimizes the use of high-frequency board materials and reduces production costs while satisfying high-frequency signals.
Product Specifications
Classification and Layers
- High Frequency Hybrid Product Classification Layers: 6 เลเยอร์
Material and Dimensions
- Used Board: ro4350b + FR4
- ความหนา: 1.6มม
- Size: 210mm x 280mm
Surface Treatment and Aperture
- Surface Treatment: Gold-plated
- Minimum Aperture: 0.25มม
Application and Features
- แอปพลิเคชัน: Communication
- Features: High Frequency Mixed Pressure
