โลโก้ UGPCB
Structure and Composition
Base Plate and Layer Configuration
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from top to bottom in order from bottom to top. The second layer of solder resist ink layer is also present.
Substrate Division
The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is finally fixed, and the inlay in the high-frequency area should be located at a fixed position.
Design Features
Area Division and Material Usage
The utility model provides a high-frequency hybrid splint, which is divided into two parts: a high-frequency area and an auxiliary area. The high-frequency area is independently arranged and only made of high-frequency materials. This minimizes the use of high-frequency board materials and reduces production cost while satisfying high-frequency signal requirements.
Mechanical Support
The splint provides mechanical support to the overall structure.
Product Specifications
High Frequency Hybrid Product Classification
- เลเยอร์: 6
- Used Board: ro4350b + FR4
- ความหนา: 1.6มม
- Size: 210mm*280mm
- Surface Treatment: Gold-plated
- Minimum Aperture: 0.25มม
Application and Features
- แอปพลิเคชัน: Communication
- Features: High Frequency Mixed Pressure
