และ,พีซีบี, การปรับแต่ง PCBA และ PECVD, ผู้ผลิตต้นแบบและการผลิต

ดาวน์โหลด | เกี่ยวกับ | ติดต่อ | แผนผังเว็บไซต์

/www/wwwroot/ugpcb.com/wp-content/themes/WPPOP/inc/wppop-options.php(522) : eval()'d code(1) : eval()'d code on line 627

Warning: Undefined property: WP_Error::$parent in /www/wwwroot/ugpcb.com/wp-content/themes/WPPOP/inc/wppop-options.php(522) : eval()'d code(1) : eval()'d code on line 630
" alt="Infrared spectrometer PCBA - และ">

Infrared spectrometer PCBA

Infrared spectrometer PCBA

เลเยอร์: 2เลเยอร์

Surface Process: Immersion Gold

Black Solder mask

การทดสอบ PCB : ใช่

การทดสอบ PCBA : ใช่

Provide PCB Manufacturing : ใช่

ipcb Provide full electronic components.

การทดสอบ PCBA : ใช่ ( Customer Provide testing step with video )

RoHS compliant lead-free assembly

Looking for a experience PCB assembly manufacturer?

  • รายละเอียดสินค้า

Printed Circuit BoardAssembly Services

Printed circuit boards Assembly(พีซีบี) Services: PCB File & BOM Pls send to Sales@UGPCB.com ( fast quote)

PCBA is a process that requires knowledge not just of PCB components and assembly but also of PCB design, PCB fabrication and a strong understanding of the final product. PCBA is just one piece of the puzzle to delivering the perfect product the first time.

UGPCB assemble your PCBs with electronic components in SMT ( surface mount technology), in the conventional THT wave soldering process (through hole technology), in a combination of both processes, the new THR process (through hole reflow). All soldering processes can be performed with both lead-free solders and solders containing lead. We would be happy to take care of the complete material procurement for you.

UGPCB offer the following PCB Assembly (พีซีบี) Services:

a.Quick-turn prototype assembly,24-hour circuit board assembly service

b.Turn-key assembly,Partial turn-key assembly,Consignment assembly

c.Parts list preparation and documentation service

d.Cost-effective material procurement by means of purchasing synergies in the UGPCB

e.Automated optical inspection (AOI) of SMD assemblies

f.SMD assembly of fine-pitch components (e.g. BGA, QFN, QFP, MicroSpeed connector)

g.Handling components susceptible to moisture (moisture sensitive level ≥ 3)

h.RoHS compliant lead-free assembly

i.Soldering processes free of or containing lead

j.Production and check of the assemblies as per IPC-A610 class 2

k. SMD Assembly Equipments

ทิ้งคำตอบไว้

ฝากข้อความ