F4B-1/2 Teflon PCB Glass Fabric Copper-Clad Laminates

F4B-1/2 Teflon PCB glass fabric copper-clad laminates are designed to meet the stringent electrical performance requirements of microwave circuits. These laminates stand out due to their excellent electrical properties and enhanced mechanical strength, making them ideal for microwave PCB applications.

Technical Specifications

Appearance

The appearance of these laminates meets the specification requirements set by National and Military Standards for microwave PCB laminates.

Types

F4B255
F4B265

Dielectric Constant

2.55
2.65

Available Dimensions (มม)

300×250, 380×350, 440×550, 500×500, 460×610, 600×500
840×840, 1200×1000, 1500×1000
Custom dimensions are available upon request.

Copper Thickness

0.035μm, 0.018μm

Thickness and Tolerance (มม)

Laminate Thickness	Tolerance
0.17, 0.25	±0.025
0.5, 0.8, 1.0	±0.05
1.5, 2.0	±0.05
3.0, 4.0, 5.0	±0.09

The laminate thickness includes the copper thickness. Custom dimensions are available upon request.

Mechanical Strength

ความหนา (มม)	Maximum Warp	Single Side	Double Side
0.25～0.5	0.030	0.050	0.025
0.8～1.0	0.025	0.030	0.020
1.5～2.0	0.020	0.025	0.015
3.0～5.0	0.015	0.020	0.010

Cutting/Punching Strength:

Thickness ≤1mm: No burrs after cutting, minimum space between punching holes is 0.55mm, no delamination.
ความหนา >1มม: No burrs after cutting, minimum space between punching holes is 1.10mm, no delamination.

Peel Strength (1oz copper)

Normal State: ≥15N/cm; No bubbles or delamination.
After Exposure to Constant Humidity and Temperature: Peel strength ≥12N/cm (after keeping in melting solder at 260°C ±2°C for 20 seconds).

Chemical Properties

These laminates can be chemically etched using standard PCB methods without changing their dielectric properties. Plating through holes is possible but requires sodium treatment or plasma treatment.

Electrical Properties

ชื่อ	Test Condition	Unit	Value
Density	Normal state	g/cm³	2.2～2.3
Moisture Absorption	Dip in distilled water 20±2°C for 24 hours	%	≤0.1
Operating Temperature	High-low temperature chamber	องศาเซลเซียส	-50～+260
Thermal Conductivity		W/m/k	0.3
ซีทีอี (typical)	0～100°C	ppm/°C	x:16, y:21 z:186
Shrinkage Factor	2 hours in boiling water	%	≤0.0002
Surface Resistivity	500V DC, Normal state	M·Ω	≥1*10⁴
	Constant humidity and temperature		≥5*10³
Volume Resistivity	Normal state	MΩ.cm	≥1*10⁶
	Constant humidity and temperature		≥9*10⁴
Pin Resistance	500VDC, Normal state	MΩ	≥5*10⁴
	Constant humidity and temperature		≥5*102
Surface Dielectric Strength	Normal state, d=1mm (Kv/mm)		≥1.2
	Constant humidity and temperature		≥1.1
Dielectric Constant	10GHZ,	εr	2.55/2.65 (±2%)
Dissipation Factor	10GHZ,	tgδ	≤1*10⁻³

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