โลโก้ UGPCB
Material Composition and Manufacturing Process
F4BM-2 & F4BM Radio frequency PCB material is laminated by laying up of woven glass fabric, bond film, with Teflon PCB resin and Polytrtrafluoroethylene(PTFE) film, according to the scientific formulation and strict technology process. F4BM-2 takes some advantages over F4B series in the electrical performance (wider range of dielectric constant, lower dielectric loss angle tangent, increased resistance and more stability of performance).
Dielectric Constant Specifications
F4BM-2 & F4BM Dielectric Constant: f4bm220(dk 2.20), f4bm255(dk 2.55), f4bm265(dk 2.65), f4bm300(dk 3.0). Support customized dielectric constant.
Standard Dimensions
F4BM-2 Dimension(มม): 300250, 380350, 440550, 500500, 460610, 600500, 840840, 8401200, 1500*1000. For special dimension, customized laminates is available.
Material Thickness
F4BM-2 PCB material thickness(มม): 0.25, 0.5, 0.8, 1.0, 1.5, 2.0, 3.0, 4.0, 5.0, 6.0, 8.0, 10.0, 12.0.
PTFE PCB and Teflon Properties
Teflon Properties
Teflon is a polymer obtained by polymerization of tetrafluoroethylene monomer. Its molecular structure can be regarded as the replacement of hydrogen atoms in polyethylene by fluorine atoms. Due to the existence of the strong C-F bond, Teflon has many properties that polymer materials lack, such as particularly low temperature resistance, particularly corrosion resistance, particularly difficult to be wetted, high lubrication, non-adhesion and so on. It is an important field in the fluorine chemical industry with rapid development, high technical content and good prospects. It is widely used in petroleum, chemical, electronic appliances, medical, machinery and other fields.
F4BM-2 Teflon PCB
The main components of F4BM-2 are Teflon and glass fiber, which are made by Chinese PCB material manufacturers, so F4BM-2 has a very good cost performance.
Applications in China
F4BM-2 has been mass-produced and applied in China, such as 3G antenna PCB, 4G antenna PCB and so on. Specifically, F4BM-2 Teflon PCB has been adopted in these advanced communications technologies.
