โลโก้ UGPCB
F4BMX-1/2 Teflon PCB Overview
F4BMX-1/2 is a high-performance laminate crafted by layering imported varnished glass cloth with Teflon resin and Polytrtrafluoroethylene film. This product adheres to scientific formulations and stringent technological processes, offering superior electrical performance compared to the F4B series. It features a broader range of dielectric constants, lower dielectric loss tangent, increased resistance, and more stable performance. The use of imported woven glass fabric ensures consistency in the properties of the laminate.
F4BMX-1/2 Technical Specifications
Appearance
Meets the specification requirements for microwave PCB laminates according to national and military standards.
Types
- F4BMX217
- F4BMX220
- F4BMX245
- F4BMX255
- F4BMX265
- F4BMX275
- F4BMX285
- F4BMX294
- F4BMX300
Dielectric Constant
- F4BMX217: 2.17
- F4BMX220: 2.20
- F4BMX245: 2.45
- F4BMX255: 2.55
- F4BMX265: 2.65
- F4BMX275: 2.75
- F4BMX285: 2.85
- F4BMX294: 2.94
- F4BMX300: 3.0
Dimensions (มม)
- Standard dimensions available: 300250, 380350, 440550, 500500, 460610, 600500, 840840, 8401200, 15001000, 18001000
- Customized dimensions are also available.
Thickness and Tolerance (มม)
| Laminate Thickness | Tolerance |
|---|---|
| 0.25 | ±0.025 |
| 0.5 | ±0.05 |
| 0.8 | ±0.05 |
| 1.0 | ±0.05 |
| 1.5 | ±0.075 |
| 2.0 | ±0.09 |
| 3.0 | ±0.1 |
| 4.0 | ±0.1 |
| 5.0 | ±0.1 |
| 6.0 | ±0.12 |
| 8.0 | ±0.15 |
| 10.0 | ±0.18 |
| 12.0 | ±0.2 |
Note: The laminate thickness includes the copper thickness. Customized laminates are available for special dimensions.
Mechanical Strength
| ความหนา(มม) | Maximum Warp | Original Board | Single Side | Double Side |
|---|---|---|---|---|
| 0.25～0.5 | 0.030 | 0.050 | 0.025 | 0.020 |
| 0.8～1.0 | 0.025 | 0.030 | 0.020 | 0.020 |
| 1.5～2.0 | 0.020 | 0.025 | 0.015 | 0.015 |
| 3.0～5.0 | 0.015 | 0.020 | 0.010 | 0.010 |
Cutting/Punching Strength:
- For thickness <1มม, no burrs after cutting; minimum space between two punching holes is 0.55mm, no delamination.
- For thickness >1มม, no burrs after cutting; minimum space between two punching holes is 1.10mm, no delamination.
Peel strength (for 1oz copper):
- Normal state: ≥18N/cm; No bubble or delamination peel strength: ≥15N/cm (in constant humidity and temperature, and kept in molten solder at 260 degree Celsius±2 degree Celsius for 20 seconds).
Chemical Property
The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment. Hot Air Level temperature must not exceed 253 degrees Celsius and cannot be repeated.
Electrical Property
| ชื่อ | Test Condition | Unit | Value |
|---|---|---|---|
| Density | Normal state | g/cm³ | 2.1～2.35 |
| Moisture Absorption | Dip in distilled water at 20±2°C for 24 hours | % | ≤0.08 |
| Operating Temperature | High-low temperature chamber | degree Celsius | -50°C～+260°C |
| Thermal Conductivity | W/m/k | 0.3~0.5 | |
| ซีทีอี | Typical (εr :2.1~2.3) | ppm/°C | X: 24(x), Y: 34(y), Z: 235(z) |
| ซีทีอี | Typical (εr :2.3~2.9) | ppm/°C | X: 16(x), Y: 20(y), Z: 168(z) |
| ซีทีอี | Typical (εr :2.9~3.38) | ppm/°C | X: 12(x), Y: 15(y), Z: 92(z) |
| Shrinkage Factor | 2 hours in boiling water | % | < 0.0002 |
| Surface Resistivity | DC, 500วี, Normal state | MΩ | ≥2*10^5 |
| Under constant humidity and temperature | ≥8*10^4 | ||
| Volume Resistivity | Normal state | MΩ·cm | ≥8*10^6 |
| Under constant humidity and temperature | ≥2*10^5 | ||
| Surface dielectric strength | Normal state | d=1mm(Kv/mm) | ≥1.2 |
| Under constant humidity and temperature | ≥1.1 | ||
| Dielectric Constant | 10กิกะเฮิรตซ์, εr | (±2%) | See table below |
| Dissipation Factor | 10GHz tgδ | See table below |
Dielectric Constant and Dissipation Factor at 10GHz
| Type | Dielectric Constant (εr) | Dissipation Factor (tgδ) |
|---|---|---|
| F4BMX217 | 2.17 | – |
| F4BMX220 | 2.20 | – |
| F4BMX245 | 2.45 | – |
| F4BMX255 | 2.55 | – |
| F4BMX265 | 2.65 | – |
| F4BMX275 | 2.75 | – |
| F4BMX285 | 2.85 | – |
| F4BMX294 | 2.94 | – |
| F4BMX300 | 3.0 | – |
UGPCB Products and Services
UGPCB offers a variety of products including Radio/Microwave/High Frequency hybrid circuits, single layer to multilayer AnyLayerHDI, BGA, IC Heavy Copper Board, and custom solutions such as Rigid-Flex, HDI, Blind Buried Slotted Blind Back Drilled, and IC Carrier boards. Our services include PCB manufacturing, electroplating, and more. For any inquiries, please contact us through our website www.ugpcb.com or email us at sales@ugpcb.com.
