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F4B-N and F4B-T Teflon Woven Glass Fabric Copper-Clad Laminates
Introduction to F4B-N and F4B-T
F4B-N and F4B-T Teflon woven glass fabric copper-clad laminates are essential materials for manufacturing Teflon woven glass fabric copper-clad laminates. The production process involves dipping treatment of the Teflon resin on alkali-free woven glass fabric, followed by drying, baking, and sintering to formulate the microwave material. These products are characterized by heat resistance, ฉนวน, low loss, excellent electrical performance, and non-adhesion properties. They are widely used in various industries including electronics, motors, aviation, textiles, chemicals, and food. In microwave devices, they serve as bonding films for multilayer printed circuit boards.
Types of F4B-N and F4B-T Materials
- Anti-Sticking Teflon Woven Glass Fabric: F4B-N
- Ventilated Teflon Woven Glass Fabric: F4B-T
Technical Specifications of F4B-N and F4B-T
รูปร่าง
The surface is smooth and neat with uniform glue discharge and no mechanical damage.
Dimensions (มม)
- Length: A=100~200 mm
- Width: B=900~4000 mm
- ความหนา:
- F4B-N: 0.08, 0.10, 0.15, 0.40 มม
- F4B-T: 0.04, 0.07 มม
- Tolerance:
- ±0.01 mm for F4B-N
- ±0.015 mm for F4B-T
- ±0.02 mm for F4B-N
- ±0.04 mm for F4B-T
- ±0.004 mm for F4B-N
- ±0.005 mm for F4B-T
Mechanical, Chemical, and Electrical Properties
| ชื่อ | Test Condition | หน่วย | Value |
|---|---|---|---|
| แรงดึง | Tensile Machine | n(±5%) | 8 |
| Operating Temperature | In Oven | องศาเซลเซียส | 250°C long-term, 300°C discontinuous |
| Chemical Properties | Dip in Acid, Alkali and Salt | All Inert | |
| Surface Resistance Coefficient | Normal Temperature | Ω | ≥10^12 |
| Volume Resistance Coefficient | Normal Temperature | Ω·cm | ≥1*10^13 |
| Breakdown Voltage | Various Thicknesses | KV | ≥0.6 to ≥1.5 |
| ค่าคงที่ไดอิเล็กตริก | 1กิกะเฮิรตซ์ | εr | 2.7±0.1 |
| Dissipation Factor | 1กิกะเฮิรตซ์ | tgδ | ≤2×10^-4 |
For more information or to request F4B-N/F4B-T Teflon PCBs, please contact us.
